Stock Price
902.60
Daily Change
45.80 5.35%
Monthly
-16.35%
Yearly
79.30%
Q3 Forecast
849.93

EPS Reference Time Actual Consensus Previous
2026-10-27 FY2026Q3 5.52 7.82
2026-07-28 FY2026Q2 5.06 3.50
2026-04-21 FY2026Q1 5.01 3.66 3.91
2026-03-03 FY2025Q4 3.45 2.82 4.69
2025-10-28 FY2025Q3 7.82 3.8 2.71



Peers Price Chg Day Year Date
Adyen 818.70 -2.50 -0.30% -47.17% Jul/21
ASML Holding 1,593.40 72.60 4.77% 164.51% Jul/21
Ericsson 92.80 -1.00 -1.07% 28.11% Jul/21
Infineon 67.54 3.54 5.53% 81.78% Jul/21
Nokia 9.38 0.46 5.21% 128.34% Jul/21
NXP Semiconductors 266.53 -4.13 -1.53% 20.57% Jul/17
Philips 23.34 -0.32 -1.35% 10.04% Jul/21
STMicroelectronics 57.25 2.38 4.34% 104.39% Jul/21
STMicroelectronics 57.25 2.38 4.34% 103.05% Jul/21
WorldLine 10.16 0.27 2.77% -92.77% Jul/21

Indexes Price Day Year Date
NL25 1097 6.21 0.57% 21.70% Jul/21

ASM International NV traded at 902.60 this Tuesday July 21st, increasing 45.80 or 5.35 percent since the previous trading session. Looking back, over the last four weeks, ASM International NV gained 16.35 percent. Over the last 12 months, its price rose by 79.30 percent. Looking ahead, we forecast ASM International NV to be priced at 849.93 by the end of this quarter and at 794.08 in one year, according to Trading Economics global macro models projections and analysts expectations.

ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.